Laser System L2000

Now Available on Cincom A20, L12, L20, L32 and Miyano BNA-42GTY
  • Laser Cutting, Welding and Etching
  • Near Endless Geometric Shape Possibilities
  • Minimal Burrs
  • Faster Than EDM Machining
  • Machine Accuracies .00001"

Specifications & Benefits

  • QCW (Quasi Continuous Wave) Multi Mode unit available
  • IPG Photonics leading provider of Fiber Lasers in the world
  • Laser is 100% supported in the USA
  • Air cooled
  • Multiple power units available
  • 10 Micron delivery fiber
  • Internal Pulse Generator with endless parameter possibilities
  • Cutting path and offsets FULLY controlled and edited in machine control

Optical Head Specifications

  • CCD Integrated Camera for optical viewing and alignment
  • Fine X, Y Beam adjustment for beam alignment to nozzle
  • Head assembly is completely liquid tight
  • Head is 100% made and supported in USA
  • Kerf widths down to 20 microns

LFV (Low Frequency Vibration)

Now available for Cincom machines
  • Avoid spiraling chips, entanglement of chips and built-up edges
  • Prolongs tool life & reduces problems caused by chips
  • Reduces heat generation and power consumption
  • Can be turned on and off just by inserting G codes
  • Ideal for difficult to machine materials
LFV Logo

In Low Frequency Vibration cutting, “air cutting” time provided during cutting serves to break chips up finely and expel them. This prevents the machining temperature from rising, which prolongs tool life and gives relief from various problems caused by chips.


  • Malleable materials such as copper and plastic, are easily controlled
  • Break-up of chips into very small pieces
  • Very fine work pieces are possible
  • Excellent for deep hole drilling
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Automation Systems

Now Available for Cincom and Miyano Machines

Automated material handling systems designed for Citizen machines

  • Vacuum ejection
  • Wire ejection
  • Loading / Unloading with Palletizing

Automatic unloading and palletizing system designed for medical bone screw manufacturing

  • System can unload screws as short as 8mm
  • Part quantity per bin location is programmable via the HMI
  • Random sample sequence allows for a single part inspection during the production process

Vacuum Ejection Systems

  • Workpiece ejected from the sub-spindle into the vacuum extractor
  • Workpiece deposited into external retrieval tray or carousel

Wire Ejection Systems with Support Tray

  • Designed to eject long delicate parts
  • System includes long workpiece collection tray/table
  • Ideally suited for many medical device components

Loading / Unloading with Palletizing Systems

  • Allows for in-process collection and component sampling
  • Shuttle storage tray system can be accessed during machining process to unload completed components
  • Unload shaft components into multiple position pallets
  • Load material blank to be machined directly into the machine spindle
  • Pallets automatically positioned from in-feed conveyor to retrieval position for completed components
  • Completed pallets shuttled to escape conveyor then can be removed from system